IBM 300 mm Logic Test & Wafer Finish
Wafer Finishing Operation
Visual Wafer Inspection
100% Outside Air Handling Unit
Our team provided a full suite of engineering services for a new $15MM 300 mm Logic Test and Wafer Finish operation constructed within an existing production facility. We designed and specified HVAC, utility, electrical, and controls equipment to support the 32,000+ sq. ft. Logic Test renovation that was conducted in two phases to accommodate on-going manufacturing operations. The mechanical equipment room constructed on the former rooftop was designed for the make-up air, recirculation air units and electrical equipment. The 12,000 sf class 40k clean room portion for the Wafer Finish operations was designed for space that was an open office. Column and footing upgrades were required to support 150 psf live load for the new mechanical room and manufacturing tools.
Additionally, we designed a slurry containment pit, lift station, and yard piping for hazardous waste, a 2000 KVA substation, and hydrogen distribution system.